Texas Instruments Innovation Lab
The Texas Instruments Innovation Lab (TIIL) creates a technical education ecosystem at your campus that connects industry and academia, bringing real-world engineering concepts to life. In our view, today’s students are the engineers of tomorrow. They need hands-on design experience and experiential learning to master the basics and start their careers. Students are encouraged to consider different approaches and quickly explore them in an open and collaborative environment. It lets you experiment, innovate, and solve real-world problems. Product ideas are incubated and quickly tested in the TII lab. This lab connects TI platforms and students and discovers new technology uses in engineering
Objectives
- Provide students with practical experience in programming and interfacing with microcontrollers MSP430,432 Launch pad, and Trainer kit.
- Develop skills in wireless communication protocols and technologies through the use of RF Booster packs.
- Teach students the fundamentals of real-time signal processing and its applications using DSP processors – TMS320C6678.
- Equip students with skills and knowledge relevant to the embedded systems industry, preparing them for careers in this field.
Features
- TI innovation lab trains and gives hands-on experience for students and faculty with latest products of Texas Instruments used in industry.
- TI innovation lab empowers students and faculty to showcase their innovations in terms of projects and products.
- TI innovation lab provides opportunity to the faculty and student to work on the Industry 4.0 technology, Advanced Digital Signal Processors and latest Embedded processing technology.
- TI innovation lab enables faculty and students to do research and develop solutions to the industry problems in collaboration with industry.
List of Equipments
| S.No. | Description |
| 1. | MSP 430 EXP G2 Launch Pad |
| 2. | STEPS Experimenter Pack for MSP 430 |
| 3. | MSP430F5529 USB LP Evaluation Kit |
| 4. | CC3100BOOST |
| 5. | EK-TM4C129EXL Crypto Connected LaunchPad |
| 6. | STEPS Embedded ARM Trainer Kit |
| 7. | BOOSTXL-SENSORS |
| 8. | MSP432P401R Launch Pad |
| 9. | Kentec QVGA Display BoosterPack |
| 10. | BOOSTXL-EDUMKII |
| 11. | TMDSEVM6678LE |
| 12. | STEPS IOT & Embedded Dev Kit |
| 13. | RF Booster Pack CC110L |
| 14. | TI RSLK |
Events Conducted
| SI.NO | Year | Date | Name of the programme | Resource person(s) detail | Student Strength | Faculty Strength |
| 1 | 2023 | from 21.11.2023 to 25.11.2023 | 5 days Hands on Training on “M2M Communication using MSP432, ESP32, and Raspberry Pi 4b boards” | Dr.P. SARAVANA KUMAR Dr. G.JAYAHARI PRABHU | 34 | 5 |
| 2 | 2023 | 21-03-2024 | One day Workshop on “M2M Communication using Raspberry pi” | Dr.P. SARAVANA KUMAR Dr. G.JAYAHARI PRABHU | 15 | 2 |
| 3 | 2024 | from 16th to 22nd April, 2024 | Five days Certification Course on Training on “M2M Communication using MSP432, ESP32, and Raspberry Pi boards”, | Dr.P. SARAVANA KUMAR Dr. G.JAYAHARI PRABHU | 49 | 4 |
